About Us
Integro is a fabless design house established by a group of experts in the field of design and development of Application Specific Integrated Circuit (ASIC), System on Chip (SoC) and System on Programmable Chip (SoPC) products for various range of applications. Comprehensive ASIC/SoC design methodology matching leading edge technologies has enabled Integro to deliver first-time-working complex IC products with high quality and fast time-to-market. Use of advanced industry-standard tools from leading suppliers provides highest reliability and quality to our solutions.
For more than 15 years, Integro has developed microelectronics chips and embedded systems for communication and networking technologies. Integro has employed talented and highly-educated engineers in the field of electronics (circuit and systems), computer (hardware and software) and telecommunication.
Engineering Team
Integro’s engineering team has been formed of experienced engineers in electronics, telecommunications, and computer hardware and software engineering fields with international industrial experience. A team with an average industrial experience of more than 15 years in the field, enables it to rapidly adopt new technologies, build architectures, and develop the right solution for sophisticated application-specific digital systems. Technical knowledge at Integro ranges from high-speed digital ASIC/SoC to mixed mode IC design and from low-level software development to embedded operating system and complex network protocol implementation. A talented and self-motivated group with a plenty of hands-on experience is feature characteristic of Integro.
Moreover, Integro’s ability to create comprehensive suite for development of system boards, evaluation kits and development platforms around in-house ICs along with off-the-shelf components brings one-stop solution for complex projects. Easy and fast access to system-board development, embedded system and application software for prototyping is an added-value of our design team.
Our Advantages
Design time and expenses of ASIC/SoC products are very critical factors for every IDM/OEM manufacturer as greatly affect the quality, price, and delivery schedule of the final product. In the other hand, the difficulties associated with technical supports and product updates prevents manufacturers from focusing on delivering the final complete product on-time and rapid upgrades according to customers need.
To remain competitive in the global market, semiconductor companies must continue to drive innovation. However, innovation today is being strangled through insufficient R&D budgets on the company side and an overspending hangover on the customer side. Offshore development can help on both fronts.
R&D budgets are being consumed by ever-increasing maintenance-related activities, such as bug fixing, upgrades and minor enhancements. Maintenance agreements with a large customer base accumulated over the years mandate this support. Outsourcing is one of the solutions that may reduce the risks, costs, and time of product delivery.
Our points of strength that may encourage companies to use our design services:
- Expertise in design of various digital systems and integration as system-on-chips enables us to deliver true first-time working silicon.
- Reduced engineering expenses will affect the costs associated with design of ASIC/SoC products
- Comprehensive and proven design flow eliminates the learning curves in the schedules thus reducing the project timeline.
- Experiences gained over the past 15 years, enabled us to offer the best solution for the customers’ demands and required specifications.
- Tight policies in selection of engineering team have made a small-size engineering team with easy and efficient management.
- Commitment to customers’ requirements differentiate us from other service providing companies in a sense that companies using our services can rest assured that their final products will be ready on-time while meeting specifications.
Our Services
Integro is ready to assist you in the following areas:
- Design of complicated circuits on FPGA and ASIC
- Design based on high speed processors
- Design of combined systems including CPU and hardware accelerator either in ASIC or FPGA
- Porting Linux on embedded systems
- Driver implementation and seamless integration into OS
- High-speed PCB design and tackling with signal integrity issues
- Component ordering and board assembly including BGA
- ASIC manufacturing service for existing GDS design
